Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Sang, Go Jeung | ko |
| dc.contributor.author | Cho, Young-Ho | ko |
| dc.date.accessioned | 2013-03-15T01:25:30Z | - |
| dc.date.available | 2013-03-15T01:25:30Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-01-25 | - |
| dc.identifier.citation | Proceedings of the IEEE 11th Annual International Workshop on Micro Electro Mechanical Systems, 1998, pp.318 - 321 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/115419 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000073380900057 | - |
| dc.identifier.scopusid | 2-s2.0-0031677502 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 318 | - |
| dc.citation.endingpage | 321 | - |
| dc.citation.publicationname | Proceedings of the IEEE 11th Annual International Workshop on Micro Electro Mechanical Systems, 1998 | - |
| dc.identifier.conferencecountry | GE | - |
| dc.identifier.conferencelocation | Heidelberg | - |
| dc.contributor.localauthor | Cho, Young-Ho | - |
| dc.contributor.nonIdAuthor | Sang, Go Jeung | - |
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