Adhesion Measurement Methods for Thin Films in Microelectronics
Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed.
- Publisher
- 대한용접접합학회
- Issue Date
- 2012-06
- Language
- Korean
- Citation
대한용접접합학회지, v.30, no.3, pp.15 - 20
- ISSN
- 1225-6153
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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