Adhesion Measurement Methods for Thin Films in Microelectronics

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Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed.
Publisher
대한용접접합학회
Issue Date
2012-06
Language
Korean
Citation

대한용접접합학회지, v.30, no.3, pp.15 - 20

ISSN
1225-6153
URI
http://hdl.handle.net/10203/104460
Appears in Collection
ME-Journal Papers(저널논문)
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