Adhesion Measurement Methods for Thin Films in Microelectronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김택수 | ko |
| dc.date.accessioned | 2013-03-13T04:26:34Z | - |
| dc.date.available | 2013-03-13T04:26:34Z | - |
| dc.date.created | 2013-01-08 | - |
| dc.date.created | 2013-01-08 | - |
| dc.date.issued | 2012-06 | - |
| dc.identifier.citation | 대한용접접합학회지, v.30, no.3, pp.15 - 20 | - |
| dc.identifier.issn | 1225-6153 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/104460 | - |
| dc.description.abstract | Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed. | - |
| dc.language | Korean | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | Adhesion Measurement Methods for Thin Films in Microelectronics | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 30 | - |
| dc.citation.issue | 3 | - |
| dc.citation.beginningpage | 15 | - |
| dc.citation.endingpage | 20 | - |
| dc.citation.publicationname | 대한용접접합학회지 | - |
| dc.identifier.kciid | ART001674476 | - |
| dc.contributor.localauthor | 김택수 | - |
| dc.subject.keywordAuthor | Adhesion | - |
| dc.subject.keywordAuthor | Fracture | - |
| dc.subject.keywordAuthor | Thin film | - |
| dc.subject.keywordAuthor | Microelectronics | - |
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