Control of chemical kinetics for sub-10 nm Cu nanoparticles to fabricate highly conductive ink below 150 degrees C

Abstract

To steadily apply conductive inks that contain Cu nanoparticles (NPs) to inkjet printing of patterns at temperatures below 150 degrees C, the size of the Cu NPs must be reduced. Therefore, we obtained Cu NPs in the range of 9-33 nm, and we studied how their size changes. The variation of the chemical reaction rate changed the size of the Cu NPs for two main reasons. First, the fast transition rate of the Cu precursors at high pH values raises the supersaturation level of the Cu precursor above that of a process with a slow transition rate. The high supersaturation level is generally attributed to the small Cu nuclei and the slow growth caused by their density. Second, the high viscosity of the reaction solution, which occurs because polyvinyl pyrrolidone (PVP) causes an increase in the repulsive force, slows the growth of the Cu NPs at high pH values. The recrystallization temperature of the 9 nm Cu NPs was reduced to 108 degrees C, and a low specific resistivity of 45 mu Omega cm was achieved using the conductive ink prepared with 9 nm Cu NPs at 120 degrees C. This temperature is significantly lower than those reported for other Cu NP inks. Hence, Cu NP conductive ink could considerably reduce costs because of its apparently low temperature, resolving the main bottleneck of inkjet printing on flexible (polymeric) substrates.