Direct stamping of silver nanoparticles toward residue-free thick electrode

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dc.contributor.authorKim, Jiseokko
dc.contributor.authorWubs, Kevinko
dc.contributor.authorBae, Byeong-Sooko
dc.contributor.authorKim, Woo Sooko
dc.date.accessioned2013-03-12T15:15:46Z-
dc.date.available2013-03-12T15:15:46Z-
dc.date.created2012-08-22-
dc.date.created2012-08-22-
dc.date.issued2012-06-
dc.identifier.citationSCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, v.13, no.3-
dc.identifier.issn1468-6996-
dc.identifier.urihttp://hdl.handle.net/10203/102687-
dc.description.abstractDirect stamping of functional materials has been developed for cost-effective and process-effective manufacturing of nano/micro patterns. However, there remain several challenging issues like the perfect removal of the residual layer and realization of high aspect ratio. We have demonstrated facile fabrication of flexible strain sensors that have microscale thick interdigitated capacitors with no residual layer by a simple direct stamping with silver nanoparticles (AgNPs). Polyurethane (PU) prepolymer was utilized as an adhesive layer to transfer AgNPs more efficiently during the separation step of the flexible stamp from directly stamped AgNPs. Scanning electron microscopy images and energy dispersive x-ray spectroscopy analysis revealed residue-free transfer of microscale thick interdigitated electrodes onto two different flexible substrates (elastomeric and brittle) for the application to highly sensitive strain sensors.-
dc.languageEnglish-
dc.publisherNATL INST MATERIALS SCIENCE-
dc.subjectFABRICATION-
dc.subjectFILMS-
dc.subjectDEPOSITION-
dc.subjectSUBSTRATE-
dc.subjectGOLD-
dc.subjectINK-
dc.titleDirect stamping of silver nanoparticles toward residue-free thick electrode-
dc.typeArticle-
dc.identifier.wosid000306492500005-
dc.identifier.scopusid2-s2.0-84863856937-
dc.type.rimsART-
dc.citation.volume13-
dc.citation.issue3-
dc.citation.publicationnameSCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS-
dc.identifier.doi10.1088/1468-6996/13/3/035004-
dc.contributor.localauthorBae, Byeong-Soo-
dc.contributor.nonIdAuthorKim, Jiseok-
dc.contributor.nonIdAuthorWubs, Kevin-
dc.contributor.nonIdAuthorKim, Woo Soo-
dc.description.isOpenAccessY-
dc.type.journalArticleArticle-
dc.subject.keywordAuthordirect stamping-
dc.subject.keywordAuthorsilver nanoparticles-
dc.subject.keywordAuthorflexible sensors-
dc.subject.keywordAuthorstrain sensors-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusDEPOSITION-
dc.subject.keywordPlusSUBSTRATE-
dc.subject.keywordPlusGOLD-
dc.subject.keywordPlusINK-
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