Imbricate Scales as a Design Construct for Microsystem Technologies

Cited 25 time in webofscience Cited 0 time in scopus
  • Hit : 517
  • Download : 41
DC FieldValueLanguage
dc.contributor.authorKim, Seokko
dc.contributor.authorSu, Yewangko
dc.contributor.authorMihi, Agustinko
dc.contributor.authorLee, Seung-Wooko
dc.contributor.authorLiu, Zhuangjianko
dc.contributor.authorBhandakkar, Tanmay K.ko
dc.contributor.authorWu, Jianko
dc.contributor.authorGeddes, Joseph B., IIIko
dc.contributor.authorJohnson, Harley T.ko
dc.contributor.authorZhang, Yongweiko
dc.contributor.authorPark, Jung-Kiko
dc.contributor.authorBraun, Paul V.ko
dc.contributor.authorHuang, Yonggangko
dc.contributor.authorRogers, John A.ko
dc.date.accessioned2013-03-12T07:45:31Z-
dc.date.available2013-03-12T07:45:31Z-
dc.date.created2012-06-15-
dc.date.created2012-06-15-
dc.date.issued2012-03-
dc.identifier.citationSMALL, v.8, no.6, pp.901 - 906-
dc.identifier.issn1613-6810-
dc.identifier.urihttp://hdl.handle.net/10203/101690-
dc.description.abstractSpatially overlapping plates in tiled configurations represent designs that are observed widely in nature (e.g., fish and snake scales) and man-made systems (e.g., shingled roofs) alike. This imbricate architecture offers fault-tolerant, multifunctional capabilities, in layouts that can provide mechanical flexibility even with full, 100% areal coverages of rigid plates. Here, the realization of such designs in microsystems technologies is presented, using a manufacturing approach that exploits strategies for deterministic materials assembly based on advanced forms of transfer printing. The architectures include heterogeneous combinations of silicon, photonic, and plasmonic scales, in imbricate layouts, anchored at their centers or edges to underlying substrates, ranging from elastomer sheets to silicon wafers. Analytical and computational mechanics modeling reveal distributions of stress and strain induced by deformation, and provide some useful design rules and scaling laws.-
dc.languageEnglish-
dc.publisherWILEY-V C H VERLAG GMBH-
dc.subjectBUTTERFLY SCALES-
dc.subjectADHESION-
dc.subjectPHOTOVOLTAICS-
dc.subjectELECTRONICS-
dc.subjectSKIN-
dc.titleImbricate Scales as a Design Construct for Microsystem Technologies-
dc.typeArticle-
dc.identifier.wosid000301718800016-
dc.identifier.scopusid2-s2.0-84859078101-
dc.type.rimsART-
dc.citation.volume8-
dc.citation.issue6-
dc.citation.beginningpage901-
dc.citation.endingpage906-
dc.citation.publicationnameSMALL-
dc.identifier.doi10.1002/smll.201101832-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPark, Jung-Ki-
dc.contributor.nonIdAuthorKim, Seok-
dc.contributor.nonIdAuthorSu, Yewang-
dc.contributor.nonIdAuthorMihi, Agustin-
dc.contributor.nonIdAuthorLiu, Zhuangjian-
dc.contributor.nonIdAuthorBhandakkar, Tanmay K.-
dc.contributor.nonIdAuthorWu, Jian-
dc.contributor.nonIdAuthorGeddes, Joseph B., III-
dc.contributor.nonIdAuthorJohnson, Harley T.-
dc.contributor.nonIdAuthorZhang, Yongwei-
dc.contributor.nonIdAuthorBraun, Paul V.-
dc.contributor.nonIdAuthorHuang, Yonggang-
dc.contributor.nonIdAuthorRogers, John A.-
dc.type.journalArticleArticle-
dc.subject.keywordAuthortransfer printing-
dc.subject.keywordAuthorphotonics-
dc.subject.keywordAuthorflexible electronics-
dc.subject.keywordAuthorbiomimetics-
dc.subject.keywordPlusBUTTERFLY SCALES-
dc.subject.keywordPlusADHESION-
dc.subject.keywordPlusPHOTOVOLTAICS-
dc.subject.keywordPlusELECTRONICS-
dc.subject.keywordPlusSKIN-
Appears in Collection
CBE-Journal Papers(저널논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 25 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0