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Filling of very fine via holes for 3D packaging by using ionized metal plasma sputtering and electroplating CHO, Byeong-Hoon; YUN, Jae-Jin; LEE, Won-Jong, Japanese Journal of Applied Physics, Vol.46, No.46, pp.L1135-L1137, 2007-11-22 |
Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
Ionized Metal Plasma Sputtering 및 Cu Electroplating을 이용한 3-D Packaging용 Through-Si Via Filling에 대한 연구 = Through-Si via filling for 3-D packaging by ionized metal plasma sputtering and Cu electroplatinglink 조병훈; Cho, Byeong-Hoon; et al, 한국과학기술원, 2008 |
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