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Showing results 1 to 8 of 8

1
30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Suk Jin; Kim, Jonghoon J.; Bae, Bumhee; Kim, Jonghoon; Yook, Jong-Min; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816, 2014-11

2
(A) study on multiple quantum well electroabsorption modulator with traveling wave electrode = 진행파형 전극을 가진 다중양자우물 전계흡수형 광변조기에 관한 연구link

Lim, Ji-Youn; 임지연; et al, 한국과학기술원, 2002

3
An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards

Kim Y.-J.; Yoon H.-S.; Lee S.; Moon G.; Wee J.-K.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.1, pp.97 - 106, 2004-02

4
Diversity Analysis of Multiple Transmitters in Wireless Power Transfer System

Lee, Ki-Song; Cho, Dong-Ho, IEEE TRANSACTIONS ON MAGNETICS, v.49, no.6, pp.2946 - 2952, 2013-06

5
Impedance Spectroscopy Analysis and Equivalent Circuit Modeling of Graphene Oxide Solutions

Yoon, Youngbin; Jo, Jeonghoo; Kim, Seungdu; Lee, In Gyu; Cho, Byung Jin; Shin, Myunghun; Hwang, Wan Sik, NANOMATERIALS, v.7, no.12, 2017-12

6
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

7
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

8
TiN/PECVD-Si3N4/TiN diaphragm-based capacitive-type MEMS acoustic sensor

Lee, Jae Woo; Jeon, J. H.; Kim, Y. G.; Lee, S. Q.; Yang, W. S.; Lee, Jungsoo; Lee, Sang-Gug, ELECTRONICS LETTERS, v.52, no.6, pp.468 - 469, 2016-03

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