Browse by Subject PCB FINAL FINISHES
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| A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process Kim, K. H.; Yu, Jin; Kim, J. H., SCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511, 2010-09 |
| Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM Kim, J. H.; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4335 - 4343, 2014-11 |
| Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films Yu, Jin; Kim, Kyoungdoc, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.46A, no.7, pp.3173 - 3181, 2015-07 |
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