Browse by Subject Fan-Out Panel-Level Packages (FOPLPs)▼aEpoxy Molding Films (EMFs)▼aepoxy formulation▼awarpage
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| Effects of materials properties of epoxy molding films (EMFs) on fan-out panel-level packages (FOPLPs) characteristics = 에폭시 몰딩 필름 물성과 팬아웃패키지 특성에 대한 연구link Shin, Sang-myung; Paik, Kyoung-Wook; et al, 한국과학기술원, 2019 |
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