Showing results 1 to 2 of 2
3-D Packaging 용 Through-Si Via/Trench의 충진에 관한 연구 = Filling of through-Si Via/Trench for 3-D packaginglink 김창규; Kim, Chang-Gyu; et al, 한국과학기술원, 2012 |
Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04 |
Discover