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Showing results 1 to 5 of 5

1
20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21

2
Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26

3
Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Suk, KL; Chung, CK; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.656 - 660, ECTC, 2011-05-31

4
Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18

5
Studies on various 2-metal chip-on-flex (COF) packaging methods

Suk, KL; Kim, JS; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1125 - 1131, ECTC, 2010-06-01

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