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Fabrication and characterization of SiOx/Parylene and SiNx/Parylene thin film encapsulation layers Kim N.; Potscavage, W.; Kippelen, B.; Yoo, Seunghyup; Domercq, B.; Graham, S., ASME Electronic and Photonics Packaging Division, pp.933 - 938, 2007-07-08 |
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