Showing results 1 to 2 of 2
DIII-D research advancing the physics basis for optimizing the tokamak approach to fusion energy Fenstermacher M. E.; Abbate J.; Abe S.; Abrams T.; Adams M.; Adamson B.; Aiba N.; et al, NUCLEAR FUSION, v.62, no.4, 2022-04 |
Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission Kim W.; Madhavan R.; Mao J.; Choi J.; Choi S.; Ravi D.; Sundaram V.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1506 - 1512, 2004-06-01 |
Discover