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Showing results 55641 to 55660 of 109412
| Modeling & simulation-based analysis of effectiveness of tactical level chemical defense operations Ko, Sunggil; Yun, Woo Seop; Lee, Tae-Eog, 2016 Winter Simulation Conference, WSC 2016, pp.3098 - 3109, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| Modeling 3D Cell Nucleus by Template-based Deformable Model with Confined-region Determined by Cellular Characteristics Kim, Seoyoung; Kim, Taeho; Park, Jinah, International Forum on Medical Imaging in Asia 2017 (IFMIA 2017), pp.17 - 20, International Forum on Medical Imaging in Asia, 2017-01-19 |
| Modeling a realistic fatigue crack based on statistical analysis Jin, Suyeong; Lee, Sang Eon; Hong, Jung-Wuk, The Twenty-ninth KKHTCNN Symposium on Civil Engineering, HKUST (Hong Kong University of Science and Technology), 2016-12-04 |
| Modeling a traffic control system using formal specification 차성덕, 한국정보과학회 춘계학술대회 발표논문집, 1998 |
| Modeling an Automatic Adjustment of Scanning Rate Using Fuzzy Inference Logic Ka, Hyun Wook, The 34th Annual Conference on Rehabilitation Engineering, RESNA, 2011-06-22 |
| Modeling Analysis and Control of Static Var Compensator Using Three-Level Inverter Cho, Gyu-Hyeong, IEEE IAS Rec, pp.837 - 843, IEEE, 1992-10 |
| Modeling and Algorithm for Cost Effective ATM LAN Design Lee, Ki-Dong; Lee, Heesoo; Kim, Sehun; Lee, Jong Hyup, 한국경영과학회/대한산업공학회 '99 춘계공동학술대회, pp.387 - 388, 한국경영과학회, 1999 |
| Modeling and analysis for the coexistence of PSC I and PSC II in the IEEE 802.16e system Kwon, Sang Wook; Cho, Dong-Ho, 2010 IEEE 21st International Symposium on Personal Indoor and Mobile Radio Communications, PIMRC 2010, pp.1487 - 1492, IEEE, 2010-09-26 |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Modeling and Analysis of a Nonlinear Elastomer Impact Model with Damping Mechanism Sung, Dan Keun, IECON, pp.609 - 612, 1991 |
| Modeling and analysis of a static var compensator using multilevel voltage source inverter Choi, Nam S.; Cho, Guk C.; Cho, Gyu-Hyeong, Proceedings of the 28th Annual Meeting of the IEEE Industry Applications Conference, v.2, pp.901 - 908, 1993-10-03 |
| Modeling and analysis of an energy-efficient sleep-mode operation in IEEE 802.16e system Chu,EM; Jung, BH; Sung, Dan Keun; Park, YJ, IEEE ICC 2012, IEEE, 2012-06 |
| Modeling and analysis of Buck-type three phase PWM rectifier by circuit DQ transformation Han, Soo-Bin; Choi, Nam-Sup; Rim, Chuntaek; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE, pp.431 - 436, IEEE, 1995-06 |
| Modeling and Analysis of CDMA Soft Handoff Sung, Dan Keun; Park, S; Cho, HS, IEEE Vehicular Technology Conference, pp.1525 - 1529, 1996 |
| Modeling and analysis of combined mobility management based on implicit cell update scheme in general packet radio service Chung, Y.W.; Sung, Dan Keun, 57th IEEE Semiannual Vehicular Technology Conference (VTC2003), v.57, no.1, pp.160 - 164, 2003-04-22 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and Analysis of Dual-armed Cluster Tools with Time Constraints using p-time Petri nets Kim, J.-H.; Lee, Tae-Eog, 대한산업공학회 추계학술대회, pp.1 - 4, 대한산업공학회, 2001 |
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