Showing results 29381 to 29400 of 276297
Analysis of Nanowire Alignment in a Microchannel Jeon, Y.J.; Kang, H.W.; Ko, S.H.; Sung, Hyung Jin, 9th International Symposium on Particle Image Velocimetry-PIV11, 2011-07-21 |
Analysis of nanowire alignment in a microchannel”, 9th International Symposium on Particle Image Velocimetry Jeon, YJ; Kang, HW; Ko Seung Hwan; Sung, HJ, PIV’11, PIV’11, 2011-07-21 |
ANALYSIS OF NATURAL-CONVECTION ABOUT A VERTICAL PLATE EMBEDDED IN A POROUS-MEDIUM Kim, SungJin; VAFAI, K, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.32, no.4, pp.665 - 677, 1989-04 |
Analysis of Near-Field Thermophotovoltaic Devices Using Graphene-Germanium Schottky Cell Yang, Zhimin; Song, Jaeman; Lee, Bong Jae, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.6, pp.3269 - 3274, 2023-06 |
Analysis of Nearest Neighbor Query Performance in Multidimensional Index Structures Cha, Guang-Ho; Park, Ho-Hyun; Chung, Chin-Wan, 8th Int. Conf. on Database and Expert Systems Applications, pp.498 - 507, 1997 |
Analysis of Network Lifetime in Cluster-Based Sensor Networks Lee, Soo-Bin; Lee, Hwang-Soo, IEEE COMMUNICATIONS LETTERS, v.14, no.10, pp.900 - 902, 2010-10 |
Analysis of Network on Chip Architecture for Wireless Communication System Park, Sin Chong, ITC-CSCC 2005, pp.533 - 534, 2005-07-01 |
Analysis of new parallel linear fan-beam system = 새로운 전산 단층 촬영 장치 (PLF)의 해석link Lee, Soo-Young; 이수영; et al, 한국과학기술원, 1980 |
ANALYSIS OF NEW PRODUCT DIFFUSION USING A 4-SEGMENT TRIAL-REPEAT MODEL Hahn, Minhi; PARK, S; KRISHNAMURTHI, L; ZOLTNERS, AA, MARKETING SCIENCE, v.13, no.3, pp.224 - 247, 1994 |
Analysis of Nitride or Silicide Layers on Single or Duplex Coated U-Mo Powder 김우정; 남지민; 이규홍; 류호진, 한국원자력학회 2013년 추계학술발표회, 한국원자력학회, 2013-10-24 |
Analysis of Nitrogen Recombination Activity on Silicon Dioxide with Stagnation Heat-Transfer Kim, Ikhyun; Lee, Sanghoon; Kim, Jae Gang; Park, Gisu, ACTA ASTRONAUTICA, v.177, pp.386 - 397, 2020-12 |
Analysis of NO formation in high temperature diluted air combustion in a coaxial jet flame using an unsteady flamelet model Lee, KW; Choi, Do Hyung, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.52, no.5-6, pp.1412 - 1420, 2009-02 |
Analysis of nodalization uncertainty for nuclear system analysis code with Lax-Wendroff numerical scheme Lee, Wonwoong; Lee, Jae Jun; Lee, Jeong Ik, ANNALS OF NUCLEAR ENERGY, v.167, 2022-03 |
Analysis of Noise Attenuation in Catalytic Converters Ih, Jeong-Guon, Prof. KSAE, Spring Conference, pp.91 - 96, 1995 |
Analysis of noise characteristics for the active pixels in CMOS image sensors for X-ray imaging Kim, Young-Soo; Cho, Gyu-Seong; Bae, Jun-Hyung, NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, v.565, no.1, pp.263 - 267, 2006-09 |
Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards Kim, Joungho; Rotaru, MD; Baek, S; Park, J; Yer, MK, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.319 - 330, 2006-05 |
Analysis of Noise Evolution in an Injection Seeded WDM-PON Kim, Joon-Young; Moon, Sang-Rok; Lee, Chang-Hee, OptoElectronics and Optical Communications Conference (OECC), pp.5A4-1 -, 2011-07-04 |
Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27 |
Analysis of noise removal speed and accuracy in various color spaces of image Jeon, Hyunyong; Kim, Kyung-Soo; Park, Ji-il; Lee, Minyoung; Cha, Moohyun, 20th International Conference on Control, Automation and Systems(ICCAS2020), pp.999 - 1001, Institute of Control , Robotics and Systems(ICROS), 2020-10-15 |
Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package Jeong, Y.; Kim, Joungho; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Wong, C.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.215 - 220, IEEE, 2004-08-09 |
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