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| Thermal analysis 에 의한 pure Ni 에서의 수소용해도 및 확산계수측정에 관한 연구 = Measurement of the solubility and diffusivity of hydrogen in pure nickel by thermal analysis techniquelink 이성만; Lee, Sung-Man; et al, 한국과학기술원, 1984 |
| Thermal anchoring of conduction-cooled current leads for superconductivity applications near liquid nitrogen temperature Jeong, Sang-Kwon; Kim, Young-Kwon, CRYOGENICS, v.50, no.4, pp.287 - 291, 2010-04 |
| Thermal and chemical stability of reflowed-photoresist microlenses Han, MG; Park, YJ; Kim, SH; Yoo, BS; Park, HyoHoon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.3, pp.398 - 402, 2004-03 |
| Thermal and Daylighting Optimization of Complex 3D Faceted Facade for Office Building Narangerel, Amaetuvshin; Lee, Ji-Hyun; Stouffs, Rudi, 35th International Conference on Education and Research in Computer Aided Architectural Design in Europe (eCAADe), pp.209 - 218, eCAADe, 2017-09-22 |
| Thermal and Deformation Analysis for Optimization of the LOM Process with Composite Materials Huh, Hoon; Hahn, H. T., 1st Korea-US Workshop on Composite Materials, Korea-US Workshop on Composite Materials, 1998-09-07 |
| Thermal and Electrical Conductivity of AlN Ceramics with Low Temperature Sintering Lee, Ji-Seok; Lee, Hyeon-Keun; Kim, Do Kyung, 35th International Conference and Exposition on Advanced Ceramics and Composites, The American Ceramic Society, The American Cermic Society's Engineering Ceramics Division, 2011-01-23 |
| Thermal and electrochemical characteristics of plasticized polymer electrolytes based on poly(acrylonitrile-co-methyl methacrylate) Ryoo, HJ; Kim, Hee-Tak; Lee, YG; Park, Jung-Ki; Moon, SI, JOURNAL OF SOLID STATE ELECTROCHEMISTRY, v.3, no.1, pp.1 - 6, 1998-12 |
| Thermal and electrochemical properties of ionic liquids based on N-methyl-N-alkyl morpholinium cations Choi, S; Kim, KS; Cha, JH; Lee, Huen; Oh, JS; Lee, BB, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.23, no.5, pp.795 - 799, 2006-09 |
| Thermal and electrochemical properties of morpholinium salts with bromide anion Cha, JH; Kim, KS; Choi, S; Yeon, SH; Lee, Huen; Kim, HS; Kim, H, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.22, no.6, pp.945 - 948, 2005-11 |
Thermal and field-induced transitions in ferroquadrupolar Kondo systems Frederic Freyer; Lee, SungBin; Kim, Yong Baek; Simon Trebst; Arun Paramekanti, PHYSICAL REVIEW RESEARCH, v.2, no.3, pp.033176, 2020-09 |
| Thermal and Mechanical Analysis of Solidification-Application to Continuous Casting Tszeng, T.C; Im, Yong-Taek; Kobayashi, S., Thermal Aspects in Manufacturing(edited by Attia, M.H. and Kops,L.), pp.31 - 46, 1988 |
| Thermal and Mechanical Behaviors of Nafion Thin Film in Hydrated State = 수화 상태의 나피온 박막에 대한 열적, 기계적 거동 분석link Ahn, Kwang Ho; Kim, Taek-Soo; et al, 한국과학기술원, 2019 |
| Thermal and Mechanical Characterization of Poly(L-lactic acid) Nanocomposite Scaffold park, t.g; Lee, J.H; Park, H.S; Lee, D.S; Lee, Y.K; Yoon, S.C; Nam, J.D, BIOMATERIALS, v.24, no.16, pp.2773 - 2778, 2003 |
| Thermal and Mechanical Properties of Epoxy-Graphene Composites by Using Non-covalent Functionalization Jeon, Seokwoo; Sungho, Song, RPRG, Institute of Physics (IOP), Chinese Academy of Sciences (CAS), Beijing National Laboratory for Condensed Matter Physics (BNLCP), 2012-11-06 |
| Thermal and mechanical properties of syndiotactic polystyrene/organoclay nanocomposites with different microstructures Park, CI; Choi, WM; Kim, MH; Park, OOk, JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, v.42, no.9, pp.1685 - 1693, 2004-05 |
| Thermal and Mechanical Properties of W/Cu Nanocomposite for Heat Sink Application Hong, Soon-Hyung, pp.0 - 0, 2002-06-01 |
| Thermal and Mechanical Stability Analysis of the Transmission Target of a CNT-Based Microfocus X-ray Tube Cho, Sung Oh; IHSAN, Aamir; HEO, Sung Hwan, 한국물리학회 (2006년 가을 논문발표회), pp.527 - 528, 한국물리학회, 2006 |
| Thermal and mechnical properties of PEN/PBN blends Yoon, KH; Lee. SC; Park, OOk, 1994 Spring Meeting of the Polymer Society of Korea in Seoul, Polymer Society of Korea, 1994 |
| Thermal and pulse NMR analysis of water in poly(2-hydroxyethyl methacrylate) Y. K. Sung; D. E. Gregonis; M. S. Jhon; J. D. Andrade, JOURNAL OF APPLIED POLYMER SCIENCE, v.26, no.11, pp.3719 - 3728, 1981-11 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
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