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| Signal Exaggeration in Bayesian Persuasion In, Younghwan; Lee, Jae-Yun, 6th World Congress of the Game Theory Society (GAMES 2020), The Game Theory Society, 2021-07-21 |
| Signal Exaggeration in Bayesian Persuasion Lee, JaeYun; In, Younghwan, 14th East Asian Contract Theory Conference, Institute of Economics, Academia Sinica, 2023-12-02 |
| Signal Exaggeration in Bayesian Persuasion Lee, JaeYun; In, Younghwan, 34th Stony Brook International Conference on Game Theory, Stony Brook Center for Game Theory, 2023-07-25 |
| Signal fault identification in nuclear power plants based on deep neural networks Kim, Seung Geun; Chae, Young Ho; Seong, Poong-Hyun, 30th DAAAM International Symposium on Intelligent Manufacturing and Automation, DAAAM 2019, pp.846 - 852, Danube Adria Association for Automation and Manufacturing, DAAAM, 2019-10-23 |
| Signal Filter Design for Acceleration to Measure Displacements of Masonry Walls Jang, Woo Min; Kim, Seonwoo; Choi, Youngjune; Park, Dawon; Hong, Jung-Wuk, The 33rd KKHTCNN Symposium on Civil Engineering, KKHTCNN, 2022-11-17 |
Signal flow control of complex signaling networks Lee, Daewon; Cho, Kwang-Hyun, SCIENTIFIC REPORTS, v.9, 2019-10 |
| Signal generation and stabilization techniques for sub-THz transceivers = 서브 테라헤르츠 송수신기를 위한 신호 발생 및 안정화 기술link Moon, Byeong-Taek; Lee, Sang-Gug; et al, 한국과학기술원, 2023 |
| Signal Generation due to Alpha Particle in Hydrogenated Amorphous Silicon Radiation Detectors Kim, HoKyung; Cho, Gyu-Seong, NUCLEAR ENGINEERING AND TECHNOLOGY , v.28, no.4, pp.397 - 404, 1996-06 |
| SIGNAL GENERATION IN A HYDROGENATED AMORPHOUS-SILICON DETECTOR QURESHI, S; PEREZMENDEZ, V; KAPLAN, SN; FUJIEDA, I; Cho, Gyuseong; STREET, RA, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.36, no.1, pp.194 - 198, 1989-02 |
| Signal imaging with gramian angular field based on the current signal and envelopes for anomaly detection of rotating machine = 회전기계 이상진단을 위한 전류신호와 포락선을 이용한 위상공간 이미지화 기법link Yun, Sung Hyun; 윤성현; et al, 한국과학기술원, 2024 |
| Signal increasing method in confocal scanning microscopy in fluorescent mode using curved mirror Kang, D.K.; Seo, J.W.; Gweon, Dae-Gab, International conference on control, Automation and Systems 2001, 2001-10 |
| Signal integrity (SI) design and analysis of network-on-chip (NoC) of full wafer scale chip (FWSC) for ultra-large scale ai supercomputer = 인공지능 슈퍼컴퓨터를 위한 FWSC의 NoC에 대한 신호 무결성 설계 및 분석link Kim, Juneyoung; 김준영; et al, 한국과학기술원, 2024 |
| Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig Kim, Joungho; Kim, Hyesoo; Park, Shinyoung; Kim, Jonghoon; Park, Jung-Min; Kim, UnHo; Jeon, YuckHwan, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-15 |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Signal Integrity Analysis of High Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Park, Junyong; Lee, Junho; Choi, Seongmin, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems Kim, Joungho; Park, Shinyoung; Kim, Hyesoo; Kim, Jonghoon; Kim, Unho; Park, Jungmin; Jeon, Yuckhwan, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, 2017-10-17 |
| Signal Integrity Analysis of Machine Pressed Coaxial Connector for Automotive System Kim, Joungho; Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Jonghoon; Park, Jung-Min; Kim, Un-ho; Kim, Kun-ho; et al, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, 2017-10-18 |
| Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel Ryu, Seunghun; Kim, Hyun Woong; Lee, Seonghi; Park, Dongryul; Lee, Sanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.131 - 136, Institute of Electrical and Electronics Engineers Inc., 2023-08-01 |
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05 |
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