Browse by Title
Showing results 205581 to 205600 of 276142
| TSUIMS: Implementaion of the UIMS for the Touch Screen Lee, J.; Kim, J.W.; Wohn, Kwang-Yun, 한국정보과학회 HCI 학술대회, pp.109 - 125, 한국정보과학회, 1993 |
| TSUNAMI: Triple Sparsity-Aware Ultra Energy-Efficient Neural Network Training Accelerator With Multi-Modal Iterative Pruning Kim, Sangyeob; Lee, Juhyoung; Kang, Sanghoon; Han, Donghyeon; Jo, Wooyoung; Yoo, Hoi-Jun, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.69, no.4, pp.1494 - 1506, 2022-04 |
| TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 |
| TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections Pak, Jun So; Cho J.; Kim J.; Lee J.; Lee H.; Park K.; Kim J., 2010 IEEE CPMT Symposium Japan, ICSJ10, 2010-08-24 |
| TSV 기반 3차원 소자의 열적-기계적 신뢰성 윤태식; 김택수, 마이크로전자 및 패키징학회지, v.24, no.1, pp.35 - 43, 2017-03 |
| TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
| TSV-based Decoupling Capacitor Schemes in 3D-IC Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| TSV를 이용한 3D패키징 공정 및 장비 기술 송준엽; 이재학; 하태호; 이창우; 유중돈, 한국정밀공학회지, v.26, no.12, pp.9 - 17, 2009-12 |
| TTA-COPE: Test-Time Adaptation for Category-Level Object Pose Estimation Lee, Taeyeop; Tremblay Jonathan; Blukis, Valts; Wen Bowen; Lee, ByeongUk; Shin, Inkyu; Birchfield Stan; et al, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR 2023), IEEE/CVF, 2023-06-21 |
| TTCN판정의 변별력에 대하여 강성원; 김명철; 박용범, COMSW'97(통신학회 주관), 한국통신학회, 1997 |
| TTIP의 열분해에 있어 알콜첨가에 의한 TiO2 입자크기 조절 C-33 김기영; 박승빈, 한국화학공학회 1994년 춘계, 1994 |
| Ttoal Synthesis of natural Polyquinanes Using Radical Reactions of Aziridinyl Imines: The Synthesis of $dl$-Modhephene (Abstract) 이희윤, The 77th Congress of the Korean Chemical Society, 1990 |
| TTS DB 압축을 위한 광대역 파형보간 부호기 구현 양희식; 한민수, 말소리, no.55, pp.140 - 155, 2005-09 |
| TTS DB 압축을 위한 광대역 파형보간 부호기 구현 양, 희식; 한, 민수; Yang, Heesik; Hahn, Minsoo, 대한음성학회지 말소리, Vol.55, pp.143-157, 2005-09 |
| TTX 판토그라프 틸팅 구조물의 경량화 설계 이민수; 한재흥; 김기남; 고태환, 한국철도학회 2005년도 추계학술대회, 한국철도학회, 2005-10 |
| TUBA1C 단백질을 과발현하는 엑소좀 기반 암 진단 또는 예후 예측용 마커 조성물 박지호; 김현구; 홍성회; 박용; 최연호; 최병현; 정혜선 |
| Tube Erosion Rate of Water-Wall in a Commercial Circulating Fluidized Bed Combustor kim s.d.; t.w. kim; j. h. choi; d.w. shun; j.e. son; b. j. jung; s.s. kim, KOREAN CHEMICAL ENGINEERING RESEARCH(HWAHAK KONGHAK), v.43, no.4, pp.525 - 530, 2005-08 |
| Tube formulas from Cherns kinematic formula SUNGYUN LEE; SEUNG PYO HONG, 대한수학회보(BULLETIN OF THE KOREAN MATHEMATICAL SOCIETY), v.25, no.2, pp.261 - 266, 1988-01 |
| Tube formulasl in product Riemannian manifolds II Sungyun Lee; Ki Hyoung Ko; U Jin Choi; Do Young Kwak, 대한수학회논문집(COMMUNICATIONS OF THE KOREAN MATHEMATICAL SOCIETY), v.3, no.1, pp.93 - 98, 1988-01 |
| TUBE STRUCTURE HAVING METAL ON INNER SURFACE THEREOF Choi, Jang Wook; Park, Eunkyung; Jang, Minchul; Son, Byoungkuk; Choi, Junghun; Kang, Donghyeon; Kim, Byung Gon |
Discover
Type
Open Access
Date issued
- 31,154 2020 - 2024
- 99,968 2010 - 2019
- 75,670 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969