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| Thermal stability of nanocrystalline nickel-18 at.% tungsten alloy investigated with the tomographic atom probe Choi, Pyuck-Pa; Al-Kassab, T; Gartner, F; Kreye, H; Kirchheim, R, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.353, no.1-2, pp.74 - 79, 2003-07 |
| Thermal stability of RuO2 thin films prepared by modified atomic layer deposition Kim, Jin-Hyock; Ahn, Ji-Hoon; Kang, Sang-Won; Roh, Jae-Sung; Kwon, Se-Hun; Kim, Ja-Yong, CURRENT APPLIED PHYSICS, v.12, pp.S160 - S163, 2012-09 |
| Thermal stability of RuO2-based bottom electrodes during various ambient annealings Ahn, JH; Park, JH; Choi, GP; Choi, WY; Kim, Ho Gi; Lee, WJ; Yoon, SG, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.S491 - S495, 1999-07 |
| Thermal stability of sol-gel derived methacrylate oligosiloxane-based hybrids for LED encapsulants Kim, Joon-Soo; Yang, Seung-Cheol; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.53, pp.434 - 440, 2010-02 |
| Thermal stability of superconductors with large surface barriers to flux entry: Superconducting power‐line conductors Kim, Sehun; Howard, R.E; Beasley, M.R, JOURNAL OF APPLIED PHYSICS, v.49, no.2, pp.730 - 735, 1978-02 |
| Thermal stability of the exchanged biased CoFe/IrMn electrode for the magnetic tunnel junction as a function of CoFe thickness Lee, JH; Kim, SJ; Yoon, CS; Kim, CK; Park, Byong Guk; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.92, no.10, pp.6241 - 6244, 2002-11 |
| Thermal Stability of the Multiple Isoforms of Inulase from Aspergillus niger Uhm T. B.; Kwon Y. J.; Han S. B.; Byun, Si Myung, BIOTECHNOLOGY LETTERS, v.9, no.4, pp.287 - 290, 1987 |
| Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05 |
| Thermal stability study of BaAl2Si2O8 : Eu2+ phosphor using its polymorphism for plasma display panel application Im, WB; Kim, YI; Jeon, DukYoung, CHEMISTRY OF MATERIALS, v.18, no.5, pp.1190 - 1195, 2006-03 |
| Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05 |
| Thermal stabilization for accurate dimensional measurement using gallium Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06 |
| Thermal Stabilization of Aspergillus Phytase by L-Arginine Ryu, S; Park, Tae Gwan, BIOTECHNOLOGY AND BIOPROCESS ENGINEERING, v.3, no.0, pp.32 - 34, 1998-05 |
| Thermal stress analysis in structural elements of HRSG casing Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012 |
| Thermal stress analysis of silo in radioactive waste repository considering construction conditions Cha, Sang Lyul; Lee, Yun; Kim, Jin-Keun, NUCLEAR ENGINEERING AND DESIGN, v.322, pp.412 - 426, 2017-10 |
| Thermal stress and fatigue analysis of exhaust manifold Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004 |
| Thermal stress in silica-on-silicon disk resonators Chen, Tong; Lee, Hansuek; Vahala, Kerry J., APPLIED PHYSICS LETTERS, v.102, no.3, 2013-01 |
| Thermal suppression of high-repetition rate SBS pulse compression in liquid media Wang, Hongli; Cha, Seongwoo; Kong, Hong jin; Wang, Yulei; Lu, Zhiwei, OPTICS EXPRESS, v.30, no.21, pp.38995 - 39013, 2022-10 |
| Thermal transfer behavior in two types of W-shape ground heat exchangers installed in multilayer soils Yoon, Seok; Lee, Seung Rae; Go, Gyughyun; Xue, Jianfeng; Park, Hyunku; Park, Dowon, GEOMECHANICS AND ENGINEERING, v.6, no.1, pp.79 - 98, 2014-01 |
| Thermal Transformation of Molecular Ni2+-N-4 Sites for Enhanced CO2 Electroreduction Activity Sa, Young Jin; Jung, Hyejin; Shin, Dongyup; Jeong, Hu Young; Ringe, Stefan; Kim, Hyungjun; Hwang, Yun Jeong; et al, ACS CATALYSIS, v.10, no.19, pp.10920 - 10931, 2020-10 |
Thermal transport in layer-by-layer assembled polycrystalline graphene films Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03 |
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