A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film

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A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.
Publisher
WILEY-BLACKWELL
Issue Date
2011-12
Language
English
Article Type
Article
Keywords

SOLAR-CELLS; SEMICONDUCTOR; PERFORMANCE; ELECTRONICS; TRANSISTORS

Citation

ADVANCED MATERIALS, v.23, no.46, pp.5524 - 5524

ISSN
0935-9648
URI
http://hdl.handle.net/10203/95685
Appears in Collection
CBE-Journal Papers(저널논문)
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