During the curing process of thick glass, epoxy composite laminates, substantial amounts of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass,epoxy composites, which require a long time for full and uniform consolidation. In this work. the temperature profiles of a 20 mm thick unidirectional glass, epoxy laminate during an autoclave vacuum hag process were measured and compared with the numerically Calculated results. For the calculation of distributions of the temperature, degree of cure, resin pressure, exothermic heat and required time for full consolidation by three-dimensional finite element analyses. the effects of convective heat transfer coefficient and geometry of mold and bagging assembly on the temperature profiles were taken into consideration. Based on the numerical results. an optimized cure cycle with the cooling and reheating steps was developed by minimizing the objective function to reduce the temperature overshoot in the composite. From the experimental and numerical results. it Was found that the measured temperature profiles were in good agreement with the numerical ones. and conventional cure cycles recommended by prepreg manufacturers for thin laminates should be modified to prevent temperature overshoot and to obtain full consolidation.