Hermetically sealed inductor-capacitor (LC) resonator for remote pressure monitoring

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dc.contributor.authorPark, ECko
dc.contributor.authorYoon, Jun-Boko
dc.contributor.authorYoon, Eko
dc.date.accessioned2013-02-28T04:13:16Z-
dc.date.available2013-02-28T04:13:16Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1998-12-
dc.identifier.citationJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.12B, pp.7124 - 7128-
dc.identifier.issn0021-4922-
dc.identifier.urihttp://hdl.handle.net/10203/72719-
dc.description.abstractThis paper reports an integrated inductor-capacitor (LC) resonator structure fabricated using bulk micromachining and anodic bonding technologies. In this resonator structure, pressure change monitored by a capacitive pressure sensor results in the change of resonance frequency. The resonance frequency shift is detected by inductive coupling from an external transmission coil; therefore, pressure can be monitored remotely using the passive LC resonator. The fabricated device size measures 3 mm x 3 mm x 0.6 mm. and pressure responsivity has been estimated to be 2 MHz/mmHg. This micromachined, hermetically sealed structure is suitable for biomedical applications such as intraocular, cardiovascular and brain pressure monitoring.-
dc.languageEnglish-
dc.publisherJAPAN J APPLIED PHYSICS-
dc.titleHermetically sealed inductor-capacitor (LC) resonator for remote pressure monitoring-
dc.typeArticle-
dc.identifier.wosid000078699200092-
dc.identifier.scopusid2-s2.0-0000298124-
dc.type.rimsART-
dc.citation.volume37-
dc.citation.issue12B-
dc.citation.beginningpage7124-
dc.citation.endingpage7128-
dc.citation.publicationnameJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS-
dc.contributor.localauthorYoon, Jun-Bo-
dc.contributor.localauthorYoon, E-
dc.contributor.nonIdAuthorPark, EC-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthorintegrated LC resonator-
dc.subject.keywordAuthorbulk micromachining-
dc.subject.keywordAuthoranodic bonding-
dc.subject.keywordAuthorwireless pressure sensor-
dc.subject.keywordAuthorinductive coupling-
dc.subject.keywordAuthorhermetically sealed-
dc.subject.keywordAuthorinductor-
dc.subject.keywordAuthorelectroplating-
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