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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of binder compositions on microstructure, hardness and magnetic properties of (Ta,Nb)C-Co and (Ta,Nb)C-Ni cemented carbides Daoush, WM; Park, HS; Lee, KH; Moustafa, SF; Hong, Soon-Hyung, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.27, pp.669 - 675, 2009-07 | |
| Effect of the addition of Ag on the strengthening of Al3Li phase in Al-Li single crystals Lee, BC; Park, Joong Keun, ACTA MATERIALIA, v.46, no.12, pp.4181 - 4187, 1998-07 | |
| Suppression of abnormal grain growth in WC-Co via pre-sintering treatment Yang, Dong-Yeol; Kang, Suk-Joong L, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.27, pp.90 - 94, 2009-01 | |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 | |
| Deposition of NiAl coating for improvement of oxidation resistance of cold-rolled Ni3Al foils Kim, SH; Oh, MH; Kishida, K; Hirano, T; Wee, Dang-Moon, INTERMETALLICS, v.13, no.2, pp.129 - 136, 2005-02 | |
| Crystallization, phase evolution and corrosion of Fe-based metallic glasses: An atomic-scale structural and chemical characterization study Duarte, M. J.; Kostka, A.; Jimenez, J. A.; Choi, Pyuck-Pa; Klemm, J.; Crespo, D.; Raabe, D.; Renner, F. U., ACTA MATERIALIA, v.71, pp.20 - 30, 2014-06 | |
| A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998 | |
| Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12 |
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