Browse "MS-Journal Papers(저널논문)" by Title
Showing results 5381 to 5400 of 7207
| Relaxation of cathodoluminescent characteristics of phosphors at low-energy electron excitation Bukesov, SA; Kim, JY; Jeon, DukYoung; Strel'tsov, AV, JOURNAL OF APPLIED PHYSICS, v.91, no.11, pp.9078 - 9082, 2002-06 |
| Relaxation of remanent polarization in Pb(ZrTi)O-3 thin film capacitors Lee, KW; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, pp.6718 - 6723, 2002-11 |
| Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions 백경욱; 임명진, 한국마이크로전자 및 패키징학회지, v.7, no.1, pp.41 - 49, 2000-01 |
| Reliable Control of Filament Formation in Resistive Memories by Self-Assembled Nanoinsulators Derived from a Block Copolymer You, Byoungkuk; Park, Woon Ik; Kim, JongMin; Park, Kwi Il; Seo, Hyeon Kook; Lee, JeongYong; Jung, Yeon Sik; et al, ACS NANO, v.8, no.9, pp.9492 - 9502, 2014-09 |
| Reliable Memristive Switching Memory Devices Enabled by Densely Packed Silver Nanocone Arrays as Electric -Field Concentrators You, Byoung Kuk; Kim, Jong Min; Joe, Daniel J.; Yang, Kyoung-Hoon; Shin, Youngsoo; Jung, Yeon Sik; Lee, Keon Jae, ACS NANO, v.10, no.10, pp.9478 - 9488, 2016-10 |
| Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07 |
| Reliable thin-film encapsulation of flexible OLEDs and enhancing their bending characteristics through mechanical analysis Han, Yun Cheol; Jeong, Eun Gyo; Kim, Hyuncheol; Kwon, Seonil; Im, Hyeon-Gyun; Bae, Byeong-Soo; Choi, Kyung Cheol, RSC ADVANCES, v.6, no.47, pp.40835 - 40843, 2016-04 |
| Remarkably stable high mobility self-aligned oxide TFT by investigating the effect of oxygen plasma time during PEALD of SiO2 gate insulator Cho, Seong-In; Ko, Jong Beom; Lee, Seung Hee; Kim, Junsung; Park, Sang-Hee Ko, JOURNAL OF ALLOYS AND COMPOUNDS, v.893, 2022-02 |
| Remote Control of Time-Regulated Stretching of Ligand-Presenting Nanocoils In Situ Regulates the Cyclic Adhesion and Differentiation of Stem Cells Min, Sunhong; Ko, Min Jun; Jung, Hee Joon; Kim, Wonsik; Han, Seong-Beom; Kim, Yuri; Bae, Gunhyu; et al, ADVANCED MATERIALS, v.33, no.11, 2021-03 |
| Remote Switching of Elastic Movement of Decorated Ligand Nanostructures Controls the Adhesion-Regulated Polarization of Host Macrophages Thangam, Ramar; Kim, Myeong Soo; Bae, Gunhyu; Kim, Yuri; Kang, Nayeon; Lee, Sungkyu; Jung, Hee Joon; et al, ADVANCED FUNCTIONAL MATERIALS, v.31, no.21, 2021-05 |
Removal of Micrometer Size Morphological Defects and Enhancement of Ultraviolet Emission by Thermal Treatment of Ga-Doped ZnO Nanostructures Manzoor, Umair; Kim, Do Kyung; Islam, Mohammad; Bhatti, Arshad S., PLOS ONE, v.9, no.1, pp.1 - 8, 2014-01 |
| Repassivation Kinetics of Fe-20Cr-xNi Allys (x = 0 ~ 80 wt%) and its Relation to Stress Corrosion Susceptibility Cho, Eun Ae; Kwon, Hyuk Sang, CORROSION SCIENCE AND TECHNOLOGY, v.31, no.6, pp.448 - 453, 2002 |
| Repassivation Kinetics of Zirconium Alloys Investigated by a Scratching Electrode Technique Kim, Bo-Young; Park, Chan-Jin; Kwon, Hyuk-Sang, METALS AND MATERIALS INTERNATIONAL, v.14, no.1, pp.71 - 75, 2008-02 |
| Repetitive grain growth behavior with increasing temperature and grain boundary roughening in a model nickel system Jung, Sang Hyun; Kang, Suk-Joong L., ACTA MATERIALIA, v.69, pp.283 - 291, 2014-05 |
| Reply to comment on Local vs. global approach in the analysis of sintering kinetics Kang, Suk-Joong L, SCRIPTA MATERIALIA, v.62, pp.120 - 121, 2010-01 |
| Reprint of Overhanging ferroelectric nanodot arrays created by high surface energy seeds Kim, Ji-Yoon; Park, Kwang-Won; Hong, Jongin; No, Kwang-Soo, APPLIED SURFACE SCIENCE, v.334, pp.69 - 73, 2015-04 |
| Reproducible resistance switching for BaTiO3 thin films fabricated by RF-magnetron sputtering Jung, Chang-Hwa; Woo, Seong-Ihl; Kim, Yun-Seok; No, Kwang-Soo, THIN SOLID FILMS, v.519, no.10, pp.3291 - 3294, 2011-03 |
| Residual stress analysis of Pt bottom electrodes on ZrO2/SiO2/Si and SiO2/Si substrates for Pb(ZrTi)O-3 thick films Jeon, Y; Kim, DG; No, Kwangsoo; Kim, SJ; Chung, J, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.5A, pp.2705 - 2709, 2000-05 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Residual stress effect on self-annealing of electroplated copper Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07 |
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