Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Publisher
IEEE
Issue Date
2006-10-23
Language
ENG
Citation

IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, pp.253 - 256

URI
http://hdl.handle.net/10203/601
Appears in Collection
EE-Conference Papers(학술회의논문)
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