Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chung, D. | ko |
| dc.contributor.author | Kim, T.H. | ko |
| dc.contributor.author | Ryu, C. | ko |
| dc.contributor.author | Engin, E. | ko |
| dc.contributor.author | Swaminathan, M. | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2007-06-21T02:15:26Z | - |
| dc.date.available | 2007-06-21T02:15:26Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-10-23 | - |
| dc.identifier.citation | IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, pp.253 - 256 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/601 | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000243330600059 | - |
| dc.identifier.scopusid | 2-s2.0-47749151372 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 253 | - |
| dc.citation.endingpage | 256 | - |
| dc.citation.publicationname | IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Scottsdale, AZ | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Chung, D. | - |
| dc.contributor.nonIdAuthor | Kim, T.H. | - |
| dc.contributor.nonIdAuthor | Ryu, C. | - |
| dc.contributor.nonIdAuthor | Engin, E. | - |
| dc.contributor.nonIdAuthor | Swaminathan, M. | - |
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