전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplating

Advisors
유진researcherYu, Jinresearcher
Publisher
한국과학기술원
Issue Date
2003
Identifier
180299/325007 / 020013135
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 78 p. ]

Keywords

UBM; 솔더범프; 전해도금; 금속간화합물; Intermetallic compound; UBM; solder bump; Electroplating

URI
http://hdl.handle.net/10203/50934
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180299&flag=t
Appears in Collection
MS-Theses_Master(석사논문)
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