전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 김종연 | - |
| dc.contributor.author | Kim, Jong-Yeon | - |
| dc.date.accessioned | 2011-12-15T01:35:32Z | - |
| dc.date.available | 2011-12-15T01:35:32Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180299&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50934 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 78 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | UBM | - |
| dc.subject | 솔더범프 | - |
| dc.subject | 전해도금 | - |
| dc.subject | 금속간화합물 | - |
| dc.subject | Intermetallic compound | - |
| dc.subject | UBM | - |
| dc.subject | solder bump | - |
| dc.subject | Electroplating | - |
| dc.title | 전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 | - |
| dc.title.alternative | Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplating | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 180299/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 020013135 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.localauthor | Yu, Jin | - |
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- MS-Theses_Master(석사논문)
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