학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xiii, 171 p. ]
UBM; INTERFACIAL REACTION; SNAGCU ATION; PB-FREE SOLDER; ELECTROLESS NI; FLIP-CHIP; 계면반응; 하부금속층; 무연 솔더; 무전해 니켈; 플립칩
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