스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구A study on ultrasonic bonding with strip-type au bumps
- Advisors
- 유중돈researcher; Yoo, Choong-Donresearcher
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2004
- Identifier
- 237883/325007 / 020023069
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ vi, 64 p. ]
- Keywords
고상접합; 스트립 범프; Au 범프; 종방향 초음파; 전자패키징; Electronic packaging; Solid-state bond; Crossed strip-type bumps; Au bumps; Longitudinal ultrasonic
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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