스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구 = A study on ultrasonic bonding with strip-type au bumps

Advisors
유중돈researcherYoo, Choong-Donresearcher
Publisher
한국과학기술원
Issue Date
2004
Identifier
237883/325007  / 020023069
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ vi, 64 p. ]

Keywords

고상접합; 스트립 범프; Au 범프; 종방향 초음파; 전자패키징; Electronic packaging; Solid-state bond; Crossed strip-type bumps; Au bumps; Longitudinal ultrasonic

URI
http://hdl.handle.net/10203/45974
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=237883&flag=t
Appears in Collection
ME-Theses_Master(석사논문)
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