스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구A study on ultrasonic bonding with strip-type au bumps
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유중돈 | - |
| dc.contributor.advisor | Yoo, Choong-Don | - |
| dc.contributor.author | 김병철 | - |
| dc.contributor.author | Kim, Byung-Chul | - |
| dc.date.accessioned | 2011-12-14T06:49:12Z | - |
| dc.date.available | 2011-12-14T06:49:12Z | - |
| dc.date.issued | 2004 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=237883&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/45974 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 기계공학전공, 2004.2, [ vi, 64 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 고상접합 | - |
| dc.subject | 스트립 범프 | - |
| dc.subject | Au 범프 | - |
| dc.subject | 종방향 초음파 | - |
| dc.subject | 전자패키징 | - |
| dc.subject | Electronic packaging | - |
| dc.subject | Solid-state bond | - |
| dc.subject | Crossed strip-type bumps | - |
| dc.subject | Au bumps | - |
| dc.subject | Longitudinal ultrasonic | - |
| dc.title | 스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구 | - |
| dc.title.alternative | A study on ultrasonic bonding with strip-type au bumps | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 237883/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학전공, | - |
| dc.identifier.uid | 020023069 | - |
| dc.contributor.localauthor | 김병철 | - |
| dc.contributor.localauthor | Kim, Byung-Chul | - |
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- ME-Theses_Master(석사논문)
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