A study on lateral thermosonic bonding technology = 횡방향 열초음파 본딩 기술에 관한 연구

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In this thesis, we study the ACF interconnection technology for mounting a LCD driver IC which has a number of bumps with high density. Since the materials for bumps and pads consist of different metals, the anisotropic conductive film (ACF) should be used for adhesion. The conventional method based on the thermal energy under pressure suffers from the low productivity due to the long bonding process time. Motivated by such difficulty, thermosonic bonding which utilizes lateral ultrasonic vibration together with conventional method is proposed, and, validate by experiments. However, lateral thermosonic bonding has a potential problem of mis-alignment between bumps and pads due permanent deformation of epoxy caused by lateral vibration. To solve the problem of mis-alignment, solutions, which are based on the elasticity of ACF according to degree of cure, are suggested, and, validated by experiment. From the experimental results, the suggested solution could reduce the bonding time and avoid mis-alignment at the same time. Moreover, in ACF interconnection, the curing degree of epoxy is an important parameter because overcuring of epoxy degrades the reliability. Motivated by this problem, mechanism for desired degree of cure controlled by pressure is newly proposed, and, validated by experiment. The proposed method using the pressure as a control parameter to obtain the desired degree of cure has advantages such as prevention of overcuring and convergence of curing degree within specific region.
Advisors
Kim, Kyung-Sooresearcher김경수researcher
Description
한국과학기술원 : 기계공학전공,
Publisher
한국과학기술원
Issue Date
2010
Identifier
418901/325007  / 020083560
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 기계공학전공, 2010.2, [ x, 88 p. ]

Keywords

ACF; Bonding; Thermosonic; Anisotropic Conductive Film; Ultrasonic; 초음파; 접합; 본딩; 열초음파; 이등방성 전도 필름

URI
http://hdl.handle.net/10203/45763
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=418901&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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