Heterogeneous three-dimensional assembly of metamaterials and metadevices by modular transfer printing

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A metamaterial transfer printing method done by adhesion switching of viscoelastic stamp is presented. 3-D stack of heterogeneous material can be built at a desired position regardless of target substrate even on cheese.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Issue Date
2015-08
Language
English
Citation

11th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2015

DOI
10.1109/CLEOPR.2015.7376145
URI
http://hdl.handle.net/10203/313100
Appears in Collection
PH-Conference Papers(학술회의논문)
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