Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

The effect of silver coating on pure indium bumps for low temperature and high speed flip-chip applications is presented with respect to optoelectronic and microwave characteristics. The current-voltage and light power-current characteristics of flip-chip bonded vertical-cavity surface-emitting laser (VCSEL) arrays are improved by coating a thin silver layer of 0.2 mum. The flip-chip assembled coplanar waveguide packages using silver coated bumps show the insertion loss is about 3.3 dB/cm at 20 GHz and the return loss is under 13 dB.
Publisher
INST ENGINEERING TECHNOLOGY-IET
Issue Date
2004-11
Language
ENG
Citation

ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509

ISSN
0013-5194
DOI
10.1049/el:20046619
URI
http://hdl.handle.net/10203/2460
Appears in Collection
MS-Journal Papers(저널논문)
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