DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chu, KM | ko |
dc.contributor.author | Choi, JH | ko |
dc.contributor.author | Lee, JS | ko |
dc.contributor.author | Cho, HS | ko |
dc.contributor.author | Park, SeongOok | ko |
dc.contributor.author | Park, HyoHoon | ko |
dc.contributor.author | Jeon, DukYoung | ko |
dc.date.accessioned | 2007-12-14T09:08:09Z | - |
dc.date.available | 2007-12-14T09:08:09Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-11 | - |
dc.identifier.citation | ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509 | - |
dc.identifier.issn | 0013-5194 | - |
dc.identifier.uri | http://hdl.handle.net/10203/2460 | - |
dc.description.abstract | The effect of silver coating on pure indium bumps for low temperature and high speed flip-chip applications is presented with respect to optoelectronic and microwave characteristics. The current-voltage and light power-current characteristics of flip-chip bonded vertical-cavity surface-emitting laser (VCSEL) arrays are improved by coating a thin silver layer of 0.2 mum. The flip-chip assembled coplanar waveguide packages using silver coated bumps show the insertion loss is about 3.3 dB/cm at 20 GHz and the return loss is under 13 dB. | - |
dc.description.sponsorship | This work was supported by the Center for Electronic Packaging Materials (CEPM) of the Korea Science and Engineering Foundation. The authurs would like to express an appreciation to the national program for tera-level nanodevices as one of the '21st century frontier R&D projects' funded by the Korea Ministry of Science and Technology for partial financial support of this study. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | INST ENGINEERING TECHNOLOGY-IET | - |
dc.title | Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications | - |
dc.type | Article | - |
dc.identifier.wosid | 000225461200034 | - |
dc.identifier.scopusid | 2-s2.0-9144271265 | - |
dc.type.rims | ART | - |
dc.citation.volume | 40 | - |
dc.citation.issue | 23 | - |
dc.citation.beginningpage | 1508 | - |
dc.citation.endingpage | 1509 | - |
dc.citation.publicationname | ELECTRONICS LETTERS | - |
dc.identifier.doi | 10.1049/el:20046619 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Park, SeongOok | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.localauthor | Jeon, DukYoung | - |
dc.contributor.nonIdAuthor | Chu, KM | - |
dc.contributor.nonIdAuthor | Choi, JH | - |
dc.contributor.nonIdAuthor | Lee, JS | - |
dc.contributor.nonIdAuthor | Cho, HS | - |
dc.type.journalArticle | Article | - |
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