학위논문(석사) - 한국과학기술원 : 신소재공학과, 2017.2,[vii, 61 p. :]
Wearable electronics package; Anisotropic conductive films (ACFs); Flex-on-Fabric (FOF); Interconnection; E-textiles; Vertical ultrasonic bonding; 웨어러블 전자기기 패키지; 이방성 전도 필름; 초음파 본딩; 전자섬유; 접속
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