Photolithography-Based Patterning of Liquid Metal Interconnects for Monolithically Integrated Stretchable Circuits

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We demonstrate a new patterning technique for gallium-based liquid metals on flat substrates, which can provide both high pattern resolution (similar to 20 mu m) and alignment precision as required for highly integrated circuits. In a very similar manner as in the patterning of solid metal films by photolithography and lift-off processes, the liquid metal layer painted over the whole substrate area can be selectively removed by dissolving the underlying photoresist layer, leaving behind robust liquid patterns as defined by the photolithography. This quick and simple method makes it possible to integrate fine-scale interconnects with preformed devices precisely, which is indispensable for realizing monolithically integrated stretchable circuits. As a way for constructing stretchable integrated circuits, we propose a hybrid configuration composed of rigid device regions and liquid interconnects, which is constructed on a rigid substrate first but highly stretchable after being transferred onto an elastomeric substrate. This new method can be useful in various applications requiring both high-resolution and precisely aligned patterning of gallium-based liquid metals.
Publisher
AMER CHEMICAL SOC
Issue Date
2016-06
Language
English
Article Type
Article
Keywords

PRINTABLE ELASTIC CONDUCTORS; SOFT-MATTER ELECTRONICS; GALLIUM-INDIUM ALLOY; WEARABLE ELECTRONICS; HIGH-CONDUCTIVITY; TAPE TRANSFER; FABRICATION; PERFORMANCE; TRANSISTORS; PAPER

Citation

ACS APPLIED MATERIALS & INTERFACES, v.8, no.24, pp.15459 - 15465

ISSN
1944-8244
DOI
10.1021/acsami.6b01896
URI
http://hdl.handle.net/10203/212281
Appears in Collection
CBE-Journal Papers(저널논문)
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