학위논문(박사) - 한국과학기술원 : 신소재공학과, 2015.8 ,[xi, 97 p. :]
Anisotropic conductive Film; Solder joint; Ultrasonic bonding; Electronic packaging reliability; Solder shape; 이방성 전도 필름; 솔더 조인트; 초음파 본딩; 전자 패키징 신뢰성; 솔더 형상
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