Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 18021 to 18040 of 22767
| Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, SeongGuk; Park, Joonsang; Kim, Keunwoo; Choi, Namhyeon; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Thermal annealing chracteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, J.Y.; Jun, K.H.; Konagai, M.; Lim, Koeng Su, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.1741 - 1744, 2003-05-11 |
| Thermal Annealing 효과에 의한 다층박막 FBAR 소자의 공진특성개선 윤기완; 김동현; 임문혁; Linh, Mai, 한국해양정보통신학회추계학술대회, pp.633 - 636, 한국해양정보통신학회, 2003-10 |
| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal conductivity measurement of silicon/silicide laminated structures by 3w method Choi, Won Cheol; Kim, Jun Soo; Kim, Soo Jeong; Kim, Tae Kwang; Jung, Heun Dal; Jung, Tae Hyung; Nam, Eun Soo; et al, 2015 European Materials Research Society (EMRS) Spring Meeting, EMRS, 2015-05-14 |
| Thermal conductivity of ultrathin Si films with a periodic pore pattern Oh, Jung Hyun; Choi, Won Chul; Jang, Moon Kyu; Shin, Mincheol, 17th International Workshop on Computational Electronics, IWCE 2014, 2014-06-06 |
| Thermal effects on interconnect crosstalk of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Nakarmi, Bikash; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, SPIE/COS Photonics Asia 2012, The International Society for Optical Engineering, Chinese Optical Society, 2012-11-07 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Thermal image enhancement using convolutional neural network Choi, Yukyung; Kim, Namil; Hwang, Soonmin; Kweon, In-So, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2016), IEEE Robotics and Automation Society (RAS), 2016-10-11 |
| Thermal Improvement for 2.75 GHz-FBAR Devices Yoon, Giwan; Linh, Mai; Lee, Jae-young; Pham, Van-Su; Kabir, S. M. Humayun; Dang, Hoai-Bac, 한국해양정보통신학회 추계종합학술대회 , pp.196 - 199, 한국해양정보통신학회, 2007-10 |
| Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 3차원반도체집적기술 특집, 전자공학회지, 2009-09 |
| Thermal Management of Gallium-based Transformative Electronics through Integration of a Stretchable Radiative Cooler for Reliable Stiffness Tuning in Hot Outdoors Byun, Sanghyuk; Yun, Joo Ho; Heo, Se-Yeon; Shi, Chuanqian; Lee, Gil Ju; Agno, Karen-Christian; Jang, Kyung-In; et al, 2022 MRS Fall Meeting, Materials Research Society, 2022-11-28 |
| Thermal Noise Model for Short-Channel MOSFETs Han, Kwangseok; Shin, Hyungcheol; Lee, Kwyro, The 10th Korean Conference on Semiconductors, The 10th Korean Conference on Semiconductors, 2003-02 |
| Thermal Noise Modeling for Short - Channel MOSFET's Lee, Kwyro; Shin, Hyung-Cheol; Han, Kwangseok, International Conference on Simulation of Semiconductor Processes and Devices(SISPAD), pp.79 - 82, 2003 |
| Thermal signature: a simple yet accurate thermal index for floorplan optimization Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08 |
| Thermal signature: 자동 floorplanning을 위한 빠르고 정확한 온도 지표 신영수, 한국반도체학술대회, 한국반도체학회, 2011 |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; et al, DesignCon 2022, IEEE, 2022-04-07 |
| Thermal-aware energy minimization of 3D-stacked L3 cache with error rate limitation Yun, W.; Kang, K.; Kyung, Chong-Min, 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011, pp.1672 - 1675, IEEE, 2011-05-15 |
| Thermal-Infrared based Drivable Region Detection Yoon, Jaeshin; Park, Kibaek; Hwang, Soonmin; Kim, Namil; Choi, Yukyung; Rameau, Francois; Kweon, In So, 2016 IEEE Intelligent Vehicles Symposium, pp.978 - 985, 2016 IEEE Intelligent Vehicles Symposium, 2016-06-21 |
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