Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 5501 to 5520 of 22817
| Chemical Analysis and Thermal Curing Effects of CVD graphene during transfer process Hong, Seul Ki; Cho, Byung Jin, Graphene 2012, 2012-04 |
| Chemical and Electrical Analysis of CVD Grown Graphene During Layer Transfer Process From Metal to Dielectric Substrate Hong, Seul Ki; Song, Seung Min; Cho, Byung Jin, Nature conference - Graphene : The Road to Applications, Nature Publishing Group, 2011-05 |
| Chemical Etching of InGaAsP/InP Using HBr-H3PO4-Cr2O7 and Its Applicationto Microlens array Kwon, Young Se, International Conference on Indium Phosphide and Related Materials, 2000 |
| Chemical Shift Imaging with Automatic Phase Correction 노용만; 김우성; 조민형; 조장희, 신호처리학회, pp.0 - 0, 1990-03-01 |
| Chemical Shift Imaging with Automatic Phase Correction Ro, YongMan; Kim, WS; Cho, MH; Cho, ZH, Society of Magnetic Resonance in Medicine, 1990-08-18 |
| Chemical-shift selective multislice imaging using the gradient revelsal technique Park, HyunWook; Han, Yeji; Oh, ChangHyun; Lee, YooJin, International Society for Magnetic Resonance in Maedicine, ISMRM, pp.1924 -, ISMRM, 2012-05 |
| Chip scale package for SAW filter on the oxidized porous silicon using flip-chip bonding and Cu plated metal wall Ha M.-L.; Lee J.-S.; Kwon, Young Se, 52nd Electronic Components and Technology Conference, pp.372 - 377, Electronic Components and Technology Conference, 2002-05-28 |
| Chip-level Wireless Power Transfer Scheme Design for Next Generation Wireless Interconnected Three-Dimensional Integrated Circuits Song, Jinwook; Jung, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Hong, Seokwoo; Kim, Joungho, IEEE Wireless Power Transfer Conference (WPTC), IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Chip-package co-design of power distribution network for system-in-package applications Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08 |
| Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter Song, T.; Kim, J.; Pak, J.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288, IEEE, 2009-01-12 |
| Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007 |
| Chip-scale high-speed Fourier-transform spectrometer based on a combination of a Michelson and a Fabry-Perot interferometer Yu, Kyoungsik; Park, N.; Lee, D.; Solgaard, O., Proceedings of IEEE Sensors, art. v.0, no.0, pp.412 - 415, IEEE, 2006 |
| Chip-scale wavelength standards(*) Bopp, Douglas G.; Hummon, Matthew T.; Kang, Songbai; Kitching, John; Li, Qing; Westly, Daron A.; Kim, Sangsik; et al, 7th International School of Physics "Enrico Fermi" on New Frontiers for Metrology: From Biology and Chemistry to Quantum and Data Science, pp.443 - 449, IOS Press BV, 2019-07 |
| Chip-to-chip optical interconnect using direct optical wire bonding Rhee, Hyun-Woo; You, Jong Bum; Kim, Jaeyong; Yoon, Hyeonho; Kim, Myeongho; Kim, Chong Kook; Park, Hyo-Hoon, Conference on Optical Interconnects XXII at SPIE OPTO Conference, SPIE-INT SOC OPTICAL ENGINEERING, 2022-01 |
| Chip-to-chip optical link by using optical wiring method Cho, I.K.; Ahn, S.H.; Jeong, M.Y.; Rho, B.S.; Park, HyoHoon, Photonics: Design, Technology, and Packaging III, v.6801, pp.0 - 0, SPIE, 2007-12-05 |
| Chirp Pulse Radar에 적용 가능한 특이 값 분해를 이용한 Clutter 제거 기법 및 이를 이용한 소형 드론 탐지 배경빈; 박성욱; 양동하, 2022년 한국전자파학회 동계종합학술대회, (사)한국전자파학회, 2022-02-11 |
| Chirp Pulse 레이다에 적용 가능한 Micro-Doppler Signature 추출 기법 및 이를 이용한 소형 드론 탐지 배경빈; 박성욱; 지예은; 박준성, 2020 한국전자파학회 하계종합학술대회, 한국전자파학회, 2020-08-21 |
| Chirp Pulse 레이다에 적용 가능한 Phase Calibration 기법 및 이를 이용한 소형 드론 탐지 배경빈; 박성욱; 지예은, 2021년도 한국전자파학회 동계종합학술대회, 한국전자파학회, 2021-02-18 |
| Chirp stitching and bandwidth extention methods for fine resolution image Lim, Jong-Tae; Kang, KI; Jeon, JH; Shin, HS, International conference on Electrical engineering (ICEE2006), ICEE, 2006-07 |
| Chirped pulse amplification in an 0.5-MHz Ti:sapphire regenerative amplifier with quadratic and cubic dispersion compensation Rhee, June-Koo Kevin; Sosnowski, T. S.; Norris, T. B.; Colburn, W. S.; Ulrich, P., Conference on Lasers and Electro-Optics, pp.604 - 604, Optical Society America, 1993-05 |
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