Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 25481 to 25500 of 51620
| Microsecond Pulse I-V Approach to Understanding Defects in High Mobility Bi-layer Oxide Semiconductor Transistor Woo, Hyunsuk; Jeon, Sanghun, SCIENTIFIC REPORTS, v.7, 2017-08 |
| Microshield transmission line and spiral inductor integrated on polymer thick film Ko J.-H.; Ho S.-S.; Kwon, Young Se, 2003 IEEE MTT-S International Microwave Symposium Digest, v.3, pp.2281 - 2284, 2003-06-08 |
| MICROSTRIP CIRCUIT AND APPARATUS FOR CHIP-TO-CHIP INTERFACE COMPRISING THE SAME Bae, Hyeon-Min; SONG, Ha II; JIN, HuXian; LEE, Joon Yeong; WON, Hyo Sup; YOON, Tae Hoon, 2018-11-13 |
| Microstrip patch array antenna with high isolation characteristic Jang, Hyeong-Seok; Lim, Won-Gyu; Son, Wang-Ik; Cha, Sung-Yong; Yu, Jong-Won, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.54, no.4, pp.973 - 976, 2012-04 |
| Microstrip-waveguide transition for transmitting electromagnetic wave signal Bae, Hyeon-Min; Song , Ha Il; Lee, Joon Young; Yoon, Taehun; Won, Hyo Sup |
| Microstripline 45o, 90o convertible phase shifter Yoon, Giwan, Int`l Conf. on Microwave & Millimeter Wave Technology, pp.363 - 366, 2002-08 |
| Microstructural characterization of heterointerfaces in MOCVD grown InGaAs/GaAs strained-layer system using cross section transmission electron micros Park, M. C.; Park, HyoHoon; Kwon, O. J., Inst. Phys. the Royal Microscopical Society Conference: Microscopy of Semiconducting Materials 1993, pp.481 - 484, 1993-04-05 |
| MICROSTRUCTURAL DEGRADATION DURING ZN DIFFUSION IN A GAINASP/INP HETEROSTRUCTURE - LAYER MIXING, MISFIT DISLOCATION GENERATION, AND ZN3P2 PRECIPITATION Park, HyoHoon; LEE, KH; Lee, JeongYong; LEE, YT; LEE, EH; LEE, JY; HONG, SK; et al, JOURNAL OF APPLIED PHYSICS, v.72, no.9, pp.4063 - 4072, 1992-11 |
| Microstructural Effects on Nickel Oxide Film Properties in an Infrared Electrochromic Window for Shutter-Less Infrared Sensor Application Shim, Hyun Bin; Kim, Woo Young; Kang, In-Ku; Lee, Hee Chul, IEEE SENSORS JOURNAL, v.17, no.20, pp.6522 - 6528, 2017-10 |
| Microstructure and Optical Functions of Transparent Conductors and Their Impact on Collection in Amorphous Silicon Solar Cells Lim, Koeng Su; Ferreira, G.M.; Chen, C.; Ferlauto, A.S.; Rovira, P.I; An, I.; Wronski, C.R.; et al, 2003 MRS SPRING MEETING, v.762, pp.515 - 520, 2003-04-22 |
| Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000 |
| Microwave double-pole double-throw switch and microwave divide/through switch and power amplifier using thereof 홍성철, 2003-12-23 |
| MICROWAVE EMISSION FROM AN IRREGULAR SNOW LAYER Eom, Hyo Joon; LEE, KK; FUNG, AK, REMOTE SENSING OF ENVIRONMENT, v.13, no.5, pp.423 - 437, 1983 |
| Microwave Engineering Education at KAIST Ra, Jung Woong, Asia-Pacific Microwave Technology and Educatuon Workshop, 1991 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
| Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
| Microwave Frequency Generation, Switching, and Controlling Using Single-Mode FP-LDs Nakarmi, Bikash; Chen, Hao; Won, Yong Hyub; Pan, Shilong, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.36, no.19, pp.4273 - 4281, 2018-10 |
| Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
| Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
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