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Development of substrate-buried thick-metal process based on anodized aluminum substrate and its applications to RF passive devices = 양극산화 알루미늄 기판 기반의 기판 내장형 후막 금속 공정 개발 및 RF 수동 소자에의 응용link Kim, Cheol-Ho; 김철호; et al, 한국과학기술원, 2012 |
Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates Kim, Cheol Ho; Kwon, Young-Se, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08 |
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