DSpace at KOASAS: Development of substrate-buried thick-metal process based on anodized aluminum substrate and its applications to RF passive devices

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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Theses_Ph.D.(박사논문)

Development of substrate-buried thick-metal process based on anodized aluminum substrate and its applications to RF passive devices양극산화 알루미늄 기판 기반의 기판 내장형 후막 금속 공정 개발 및 RF 수동 소자에의 응용

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Kim, Cheol-Ho / 김철호

Advisors: Hong, Song-Cheol researcher; 홍성철

Description: 한국과학기술원 : 전기 및 전자공학과,

Publisher: 한국과학기술원

Issue Date: 2012

Identifier: 486658/325007 / 020065050

Language: eng

Description: 학위논문(박사) - 한국과학기술원 : 전기 및 전자공학과, 2012.2, [ iii, 82 p. ]

Keywords: anodized aluminum substrate; System-on-Package (SOP); buried thick metal; high-Q inductor; 시스템 온 패키지; 양극산화 알루미늄 기판; 내장형 후막 금속; 고품질 인덕터; 집적 트랜스포머; integrated transformer

URI: http://hdl.handle.net/10203/180218

Link: http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=486658&flag=dissertation

Appears in Collection: EE-Theses_Ph.D.(박사논문)

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Development of substrate-buried thick-metal process based on anodized aluminum substrate and its applications to RF passive devices양극산화 알루미늄 기판 기반의 기판 내장형 후막 금속 공정 개발 및 RF 수동 소자에의 응용

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