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Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011 |
Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011 |
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12 |
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