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Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems Park, Sung Joo; Bae, Bumhee; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.25, no.6, pp.1856 - 1865, 2017-06 |
Modeling and analysis of Die-to-Die vertical coupling and RF sensitivity degradation in 3-D IC = 집적화된 3차원 IC에서의 층간 수직 커플링 현상 분석 및 모델링과 RF 신호 민감성 저하에 대한 연구link Lee, Sang-Rok; 이상록; et al, 한국과학기술원, 2010 |
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