Statistical Characteristics of Fatigue Failure of Copper Thin Films

Cited 2 time in webofscience Cited 0 time in scopus
  • Hit : 314
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorJang, Jae-Wonko
dc.contributor.authorHwangbo, Yunko
dc.contributor.authorKim, Jae-Hyunko
dc.contributor.authorLee, Hak-Jooko
dc.contributor.authorMag-isa, Alexander E.ko
dc.contributor.authorLee, Soon-Bokko
dc.date.accessioned2014-08-28T08:26:40Z-
dc.date.available2014-08-28T08:26:40Z-
dc.date.created2013-11-25-
dc.date.created2013-11-25-
dc.date.issued2013-10-
dc.identifier.citationJOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4-
dc.identifier.issn0094-4289-
dc.identifier.urihttp://hdl.handle.net/10203/188523-
dc.description.abstractTension-tension fatigue tests were conducted on an electrodeposited copper film with a thickness of 12 mu m under four levels of maximum stress and two levels of mean stress. Statistical characteristics of the measured fatigue lives were analyzed using three estimation methods for cumulative distribution function and five probability distributions in order to identify the dominant probability distribution for the fatigue life of copper film. It was found that while the 3-parameter Weibull distribution provided the best fit for the measured data in most cases, the other distributions also provide a similar coefficient of correlation for the fit. The absence of the dominant probability distribution was discussed with considerations of the deformation mode and the scanning electron microscope (SEM) measurements of fatigue-fractured surfaces. Based on the statistical analysis, the probabilistic stress-life (PSN) curves were obtained for statistical prediction of fatigue life of the copper film in the intermediate life regime.-
dc.languageEnglish-
dc.publisherASME-
dc.subjectLIFE PREDICTION MODEL-
dc.subjectCYCLE FATIGUE-
dc.subjectSIZE-
dc.subjectFRACTURE-
dc.subjectTENSILE-
dc.subjectDEFECTS-
dc.subjectFOILS-
dc.titleStatistical Characteristics of Fatigue Failure of Copper Thin Films-
dc.typeArticle-
dc.identifier.wosid000326188700007-
dc.identifier.scopusid2-s2.0-84887596639-
dc.type.rimsART-
dc.citation.volume135-
dc.citation.issue4-
dc.citation.publicationnameJOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME-
dc.identifier.doi10.1115/1.4025319-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorJang, Jae-Won-
dc.contributor.nonIdAuthorHwangbo, Yun-
dc.contributor.nonIdAuthorKim, Jae-Hyun-
dc.contributor.nonIdAuthorLee, Hak-Joo-
dc.contributor.nonIdAuthorMag-isa, Alexander E.-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorelectrodeposited copper film-
dc.subject.keywordAuthorfatigue test-
dc.subject.keywordAuthorprobability distribution-
dc.subject.keywordAuthorstatistical analysis-
dc.subject.keywordPlusLIFE PREDICTION MODEL-
dc.subject.keywordPlusCYCLE FATIGUE-
dc.subject.keywordPlusSIZE-
dc.subject.keywordPlusFRACTURE-
dc.subject.keywordPlusTENSILE-
dc.subject.keywordPlusDEFECTS-
dc.subject.keywordPlusFOILS-
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 2 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0