학위논문(박사) - 한국과학기술원 : 신소재공학과, 2013.2, [ viii, 91 p. ]
솔더볼; 전자패키지; 무연; 계면반응; solder ball; electronic package; lead-free; interfacial reaction; solder joint reliability; 솔더 조인트 신뢰성
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