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Cu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구 = Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Culink 박혜련; Park, Hye-Lyun; et al, 한국과학기술원, 2002 |
Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties Park, HL; Byun, KM; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, no.10, pp.6153 - 6164, 2002-10 |
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