Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject IMC
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| CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03 |
| Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
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